- Part A smooth thixotropic silver paste, Part B smooth thixotropic silver paste
FLEXIBLE SILVER/GRAPHENE CONDUCTIVE EPOXY G6E-FXSG
Flexible Silver/Graphene Epoxy G6E-FXSG is a two component adhesive for high performance bonding, sealing and coating purposes. G6E-FXSG is intended to be cured at elevated temperatures. It can cure at room temperature in 24 hours or much more rapidly at elevated temperatures. Recommended curing temperature is 140Â°C-160Â°C.
G6E-FXSG has smooth paste like consistency after mixing and bonds well to a wide variety of substrates including metals, composites, ceramics, glass and plastics.
This product is recommended for flexible electronics, membrane switches, medical devices, electronic packaging applications such as die attachment and solder less interconnections, component repair, display interconnections.
. TWO COMPONENT SYSTEM: Part A -smooth thixotropic silver paste, Part B -smooth thixotropic silver paste.
. THE MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
. CURING INSTRUCTIONS: Best results are obtained when the product is cured at one of the following rates: 24 hours @ 25Â°C, 3 hours @ 60Â°C followed by 30 minutes @ 140-160Â°C or 1-2 hours @ 140-160Â°C.
. COLOR: Silver
. POT LIFE: 1 hour
. GLASS TRANSITION TEMPERATURE: 39Â°C (cured at 140Â°C-160Â°C)
. MIXED VISCOSITY: 110 -125 PaÂ·s at 25Â°C/77mF
. HARDNESS, SHORE: >40D
. VOLUME RESISTIVITY: Less than equals to 0.0005 ohm cm
- Middle East, Eastern Europe, North America, Asia
- All India
- Technical Data sheets are available upon request
B- 205, Prime Blue Forest, Rajapallya, Hoodi, Bengaluru, Karnataka, 560048, India